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tlc7701-ep , tlc7705-ep , tlc7733-ep www.ti.com sgls013e C march 2003 C revised november 2011 micropower supply voltage supervisors check for samples: tlc7701-ep , tlc7705-ep , tlc7733-ep 1 features supports defense, aerospace, and medical applications ? power-on reset generator ? controlled baseline ? automatic reset generation after voltage drop ? one assembly/test site ? precision voltage sensor ? one fabrication site ? temperature-compensated voltage reference ? available in extended ( C 40 c/125 c and C 55 c/125 c), temperature ranges (1) ? programmable delay time by external capacitor ? extended product life cycle ? supply voltage range . . . 2 v to 6 v ? extended product-change notification ? defined reset output from v dd 1 v ? product traceability ? power-down control support for static ram with battery backup ? maximum supply current of 16 ma ? power saving totem-pole outputs (1) additional temperature ranges available - contact factory description the tlc77xx family of micropower supply voltage supervisors provide reset control, primarily in microcomputer and microprocessor systems. during power-on, reset is asserted when v dd reaches 1 v. after minimum v dd ( 2 v) is established, the circuit monitors sense voltage and keeps the reset outputs active as long as sense voltage (v i(sense) ) remains below the threshold voltage. an internal timer delays return of the output to the inactive state to ensure proper system reset. the delay time (t d ) is determined by an external capacitor: t d = 2.1 10 4 c t (1) where c t is in farads t d is in seconds except for the tlc7701, which can be customized with two external resistors, each supervisor has a fixed sense threshold voltage set by an internal voltage divider. when sense voltage drops below the threshold voltage, the outputs become active and stay in that state until sense voltage returns above threshold voltage and the delay time (t d ) has expired. 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 2003 C 2011, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. 12 3 4 87 6 5 control resin ct gnd v dd sensereset reset d or pw package (top view)
tlc7701-ep , tlc7705-ep , tlc7733-ep sgls013e C march 2003 C revised november 2011 www.ti.com in addition to the power-on reset and undervoltage-supervisor function, the tlc77xx adds power-down control support for static ram. when control is tied to gnd, reset will act as active high. the voltage monitor contains additional logic intended for control of static memories with battery backup during power failure. by driving the chip select ( cs) of the memory circuit with the reset output of the tlc77xx and with the control driven by the memory bank select signal ( csh1) of the microprocessor (see figure 11 ), the memory circuit is automatically disabled during a power loss. (in this application the tlc77xx power has to be supplied by the battery.) ordering information orderable part top-side t a package (1) vid number number marking tlc7701qpwrep 7701qe v62/04604 - 01xe -40 c to 125 c tssop - pw tape and reel tlc7705qpwrep 7705qe v62/04604 - 02xe tlc7733qpwrep 7733qe v62/04604 - 03xe tlc7701mpwrep 7701me v62/04604 - 04xe tssop - pw tape and reel -55 c to 125 c tlc7733mpwrep 7733me v62/04604 - 06xe soic - d tape and reel tlc7701mdrep 7701me v62/04604 - 04ye (1) the pw package is only available left-end taped and reeled (indicated by the r suffix on the device type; e.g., tlc7701qpwrep). table 1. function table control resin v i(sense) > v it+ reset reset l l false h l l l true h l l h false h l l h true l (1) h (1) h l false h l h l true h l h h false h l h h true h h (1) (1) reset and reset states shown are valid for t > t d . (1) this symbol is in accordance with ansi/ieee std 91-1984 and iec publication 617-12. figure 1. logic symbol 2 submit documentation feedback copyright ? 2003 C 2011, texas instruments incorporated product folder link(s): tlc7701-ep tlc7705-ep tlc7733-ep 6 1 3 2 7 sense 1 1 1 reset 5 comp s v it s tlc7701-ep , tlc7705-ep , tlc7733-ep www.ti.com sgls013e C march 2003 C revised november 2011 functional block diagram (1) outputs are totem-pole configuration. external pullup or pulldown resistors are not required. (2) nominal values: r1 (typ) r2 (typ) tlc7701 0 tlc7705 910 k ? 290 k ? tlc7733 750 k ? 450 k ? timing diagram copyright ? 2003 C 2011, texas instruments incorporated submit documentation feedback 3 product folder link(s): tlc7701-ep tlc7705-ep tlc7733-ep 1.1 v r2 ? r1 (2) reset (1) reset (1) v dd gnd 86 5 4 resin control sense ct 3 12 7 1 m 50 a reset output output undefined v dd and v i(sense) t d threshold voltages v res v it- v it+ t d t t v it+
tlc7701-ep , tlc7705-ep , tlc7733-ep sgls013e C march 2003 C revised november 2011 www.ti.com absolute maximum ratings over operating free-air temperature range (unless otherwise noted) (1) value unit v dd supply voltage (2) 7 v input voltage range, control, resin, sense (2) -0.3 to 7 v i ol maximum low output current 10 ma i oh maximum high output current 10 ma i ik input clamp current, (v i < 0 or v i > v dd ) 10 ma i ok output clamp current, (v o < 0 or v o > v dd ) 10 ma tl77xxq -40 to 125 t a operating free-air temperature range c tl77xxm -55 to 125 t stg storage temperature range -65 to 150 c (1) stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operating conditions " is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltage values are with respect to gnd. thermal information tlc77xx-ep tlc77xx-ep thermal metric (1) d pw units 8 pins 8 pins ja junction-to-ambient thermal resistance 97.1 168 jc junction-to-case thermal resistance 39.4 38.9 jb junction-to-board thermal resistance - 96.6 c/w jt junction-to-top characterization parameter - 1.5 jb junction-to-board characterization parameter - 94.7 (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . recommended operating conditions (1) over operating free-air temperature range (unless otherwise noted) min nom max unit v dd supply voltage 2 6 v v i input voltage 0 v dd v v ih high-level input voltage at resin and control (2) 0.7 v dd v v il low-level input voltage at resin and control 0.2 v dd v i oh high-level output current, v dd 2.7 v -2 ma i ol low-level output current, v dd 2.7 v 2 ma t/ v input transition rise and fall rate at resin and control 100 ns/v q temperature range -40 125 t a operating free-air temperature range c m temperature range -55 125 (1) long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. see http://www.ti.com/ep_quality for additional information on enhanced plastic packaging. (2) to ensure a low supply current, v il should be kept < 0.3 v and v ih > -0.3 v. 4 submit documentation feedback copyright ? 2003 C 2011, texas instruments incorporated product folder link(s): tlc7701-ep tlc7705-ep tlc7733-ep
tlc7701-ep , tlc7705-ep , tlc7733-ep www.ti.com sgls013e C march 2003 C revised november 2011 electrical characteristics over recommended operating conditions (1) (unless otherwise noted) t a = -40 c to 125 c t a = -55 c to 125 c parameter test conditions unit min typ (2) max min typ (2) max v dd = 2 v 1.8 1.8 i oh = - 20 a v dd = 2.7 v 2.5 2.5 high-level output v oh v voltage v dd = 4.5 v 4.3 4.3 i oh = - 20 ma v dd = 4.5 v 3.7 3.7 v dd = 2 v 0.2 0.2 i oh = - 20 a v dd = 2.7 v 0.2 0.2 low-level output v ol v voltage v dd = 4.5 v 0.2 0.2 i oh = - 20 ma v dd = 4.5 v 0.5 0.5 tlc7701 1.04 1.1 1.16 negative-going input v it- threshold voltage, tlc7705 v dd = 2 v to 6 v 4.43 4.5 4.63 v sense (3) tlc7733 2.855 2.93 3.03 2.8 2.93 3.03 tlc7701 30 hysteresis voltage, v hys tlc7705 v dd = 2 v to 6 v 70 mv sense tlc7733 70 70 v res power-up reset voltage (4) i ol = 20 a 1 1 v resin v i = 0 v to v dd 2 2 control v i = v dd 7 15 7 15 i i input current a sense v i = 5 v 5 10 5 10 sense, tlc7701 v i = 5 v 2 only resin = v dd , sense = v dd v itmax i dd supply current + 0.2 v 9 16 9 18 a control = 0 v, outputs open v dd = 5 v, v ct = 0 , resin = v dd , i dd(d) supply current during t d sense = v dd 120 150 120 150 a control = 0 v, outputs open c i input capacitance, sense v i = 0 v to v dd 50 50 pf (1) all characteristics are measured with c t = 0.1 f. (2) typical values apply at t a = 25 c. (3) to ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 f) should be connected near the supply terminals. (4) the lowest supply voltage at which reset becomes active. the symbol v res is not currently listed within eia or jedec standards for semiconductor symbology. rise time of vdd 15 ms/v. copyright ? 2003 C 2011, texas instruments incorporated submit documentation feedback 5 product folder link(s): tlc7701-ep tlc7705-ep tlc7733-ep
tlc7701-ep , tlc7705-ep , tlc7733-ep sgls013e C march 2003 C revised november 2011 www.ti.com switching characteristics over operating free-air temperature range (unless otherwise noted) measured t a = -40 c to 125 c t a = -55 c to 125 c parameter test conditions unit from to min typ max min typ max (input) (output) resin = 0.7 v dd , ms control = 0.2 t d delay time v dd,ct = 100 nf, 1.1 2.1 4.2 2.1 t a = full range, see timing diagram propagation delay t plh time, low-to-high level 20 20 output reset propagation delay v ih = v it+max + 0.2 v, t plh time, high-to-low level 5 5 v il = v it-min - 0.2 v, output sense resin = 0.7 s propagation delay v dd,control = 0.2 v dd , t plh time, low-to-high level 5 5 c t = nc (1) output reset propagation delay t plh time, high-to-low level 20 20 output propagation delay s t plh time, low-to-high level 20 20 output reset propagation delay v ih = 0.7 v dd , t plh time, high-to-low level 60 60 v il = 0.2 v dd,sense = output resin v it+max + 0.2 v, ns propagation delay control = 0.2 v dd , t plh time, low-to-high level 65 65 c t = nc (1) output reset propagation delay s t plh time, high-to-low level 20 20 output propagation delay v ih = 0.7 v dd , ns t plh time, low-to-high level v il = 0.2 v dd,sense = 58 58 output v it+max + 0.2 v, contr reset resin = 0.7 v dd , ol propagation delay ns c t = nc (1) t plh time, high-to-low level 58 58 output v ih = v it+max + 0.2 v, sense 3 4 low-level minimum v il = v it-min - 0.2 v pulse duration to switch s v il = 0.2 v dd , reset and reset resin 1 1 v ih = 0.7 v dd t r rise time reset 10% to 90% 8 8 and ns/v 90% to 10% t f fall time 4 4 reset (1) nc = no capacitor, and includes up to 100-pf probe and jig capacitance. 6 submit documentation feedback copyright ? 2003 C 2011, texas instruments incorporated product folder link(s): tlc7701-ep tlc7705-ep tlc7733-ep
tlc7701-ep , tlc7705-ep , tlc7733-ep www.ti.com sgls013e C march 2003 C revised november 2011 parameter measurement information a. for switching characteristics, r l = 2 k ? b. c l = 50 pf includes jig and probe capacitance figure 2. reset and reset output configurations figure 3. input pulse definition waveforms copyright ? 2003 C 2011, texas instruments incorporated submit documentation feedback 7 product folder link(s): tlc7701-ep tlc7705-ep tlc7733-ep dut r l (see note a) c l (see note b) 5 v v it- t w(l) t w(l) v it+ max + 200 mv 2.7 v v it+ v it- min - 200 mv (a) resin (b) sense 0.4 v 1.5 v t w(l) 0.7 v dd 0.2 v dd 0.5 v dd m suffixed devices i, q, and y suffixed devices
tlc7701-ep , tlc7705-ep , tlc7733-ep sgls013e C march 2003 C revised november 2011 www.ti.com typical characteristics normalized input threshold voltage supply current vs vs temperature supply voltage figure 4. figure 5. high-level output voltage low-level output voltage vs vs high-level output current low-level output current figure 6. figure 7. 8 submit documentation feedback copyright ? 2003 C 2011, texas instruments incorporated product folder link(s): tlc7701-ep tlc7705-ep tlc7733-ep 10 -0.5 98 7 6 5 4 3 2 0.5 1.5 2.5 3.5 4.5 5.5 6.5 v dd - suppl y voltage - v 10 -1 resin = v dd = -1 v to 6.5 v sense = gnd control = gnd ct = open = 100 pf t a = 25 c - suppl y current - a i dd normalized input threshold v oltage - 1.005 -40 1.0041.003 1.002 1.001 1 0.9990.998 0.997 -20 0 20 40 60 80 100 120 t a - temperature - c v it- (t a )/v it- (25 c) 4.5 5 4 3.5 3 2.5 2 1.5 1 0.5 0 -5 -10 -15 -20 -25 -40 i oh - high-le vel output current - ma 0 -0.5 -1 v dd = 4.5 v resin = 4.5 v sense = 0.5 v control = 0 v ct = open = 100 pf - high-le vel output v oltage - v v oh 5 125 c 85 c 25 c -40 c -55 c 0 c -30 -35 -5 65 4 3 2 0 5 10 15 20 25 30 i ol - lo w-level output current - ma 10 -1 v dd = 4.5 v resin = 4.5 v sense = 5 v control = 0 v ct = open = 100 pf - lo w-level output v oltage - v v ol -40 c -55 c 125 c 85 c 25 c 0 c
tlc7701-ep , tlc7705-ep , tlc7733-ep www.ti.com sgls013e C march 2003 C revised november 2011 typical characteristics (continued) input current minimum pulse duration at sense vs vs input voltage at sense sense threshold overdrive figure 8. figure 9. copyright ? 2003 C 2011, texas instruments incorporated submit documentation feedback 9 product folder link(s): tlc7701-ep tlc7705-ep tlc7733-ep 0 76 5 4 3 50 100 150 200 sense threshold overdrive - mv 21 0 - minim um pulse duration at sense - s t w 250 300 350 400 v dd = 2 v control = 0.4 v resin = 1.4 v ct = open = 100 pf -1 42 0 -2-4 0 1 2 3 4 5 6 v i - input voltage at sense - v -6-8 -10 -55 c 125 c v dd = 4.5 v ct = open = 100 pf 86 - input current - a i i -55 c 125 c
tlc7701-ep , tlc7705-ep , tlc7733-ep sgls013e C march 2003 C revised november 2011 www.ti.com application information figure 10. reset controller in a microcomputer system figure 11. data retention during power down using static cmos rams 10 submit documentation feedback copyright ? 2003 C 2011, texas instruments incorporated product folder link(s): tlc7701-ep tlc7705-ep tlc7733-ep tlc77xx gnd 0.1 f reset resin reset sense control ct gnd reset v dd tms70c20 nc 100 k reset v dd v dd 0.1 f v dd gnd reset sense control ct reset gnd cs v dd tlc77xx reset csh1 add0 - 15 gnd r / w 16 8 a0 - a15 d0 - d7 data0 - 7 r / w 32k 8 cmos ram tms370 v dd resin 0.1 f 0.1 f 0.1 f
package option addendum www.ti.com 22-dec-2016 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples tlc7701mdrep active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 7701me tlc7701mpwrep active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 7701me tlc7701mpwrepg4 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 7701me tlc7701qpwrep active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7701qe tlc7705qpwrep active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7705qe tlc7733mpwrep active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 7733me tlc7733mpwtep preview tssop pw 8 tbd call ti call ti -55 to 125 tlc7733qpwrep active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7733qe v62/04604-01xe active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7701qe v62/04604-02xe active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7705qe v62/04604-03xe active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 125 7733qe v62/04604-04xe active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 7701me v62/04604-04ye active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 7701me v62/04604-06xe active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -55 to 125 7733me (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device.
package option addendum www.ti.com 22-dec-2016 addendum-page 2 (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of TLC77-EP, tlc7705-ep, tlc7733-ep : ? catalog: tlc77 , tlc7705 , tlc7733 ? automotive: tlc77-q1 , tlc7705-q1 , tlc7733-q1 ? military: tlc7705m , tlc7733m note: qualified version definitions: ? catalog - ti's standard catalog product
package option addendum www.ti.com 22-dec-2016 addendum-page 3 ? automotive - q100 devices qualified for high-reliability automotive applications targeting zero defects ? military - qml certified for military and defense applications
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant tlc7701mdrep soic d 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 q1 tlc7701mpwrep tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 tlc7701qpwrep tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 tlc7705qpwrep tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 tlc7733mpwrep tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 tlc7733qpwrep tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 package materials information www.ti.com 22-dec-2016 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) tlc7701mdrep soic d 8 2500 367.0 367.0 35.0 tlc7701mpwrep tssop pw 8 2000 367.0 367.0 35.0 tlc7701qpwrep tssop pw 8 2000 367.0 367.0 35.0 tlc7705qpwrep tssop pw 8 2000 367.0 367.0 35.0 tlc7733mpwrep tssop pw 8 2000 367.0 367.0 35.0 tlc7733qpwrep tssop pw 8 2000 367.0 367.0 35.0 package materials information www.ti.com 22-dec-2016 pack materials-page 2

www.ti.com package outline c typ 6.6 6.2 1.2 max 6x 0.65 8x 0.30 0.19 2x 1.95 0.15 0.05 (0.15) typ 0 - 8 0.25 gage plane 0.75 0.50 a note 3 3.1 2.9 b note 4 4.5 4.3 4221848/a 02/2015 tssop - 1.2 mm max height pw0008a small outline package notes: 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. this dimension does not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. this dimension does not include interlead flash. interlead flash shall not exceed 0.25 mm per side. 5. reference jedec registration mo-153, variation aa. 1 8 0.1 c a b 5 4 pin 1 id area seating plane 0.1 c see detail a detail a typical scale 2.800
www.ti.com example board layout (5.8) 0.05 max all around 0.05 min all around 8x (1.5) 8x (0.45) 6x (0.65) (r ) typ 0.05 4221848/a 02/2015 tssop - 1.2 mm max height pw0008a small outline package symm symm land pattern example scale:10x 1 4 5 8 notes: (continued) 6. publication ipc-7351 may have alternate designs. 7. solder mask tolerances between and around signal pads can vary based on board fabrication site. metal solder mask opening non solder mask defined solder mask details not to scale solder mask opening metal under solder mask solder mask defined
www.ti.com example stencil design (5.8) 6x (0.65) 8x (0.45) 8x (1.5) (r ) typ 0.05 4221848/a 02/2015 tssop - 1.2 mm max height pw0008a small outline package notes: (continued) 8. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. 9. board assembly site may have different recommendations for stencil design. symm symm 1 4 5 8 solder paste example based on 0.125 mm thick stencil scale:10x
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